AI-Thinker TB-03F-kit Development Board

TB-03F-Kit development board is an intelligent lighting development board designed for TB-03F modules. There are five PWM, that can be adjusted by themselves RGB colorful lights and two cold and warmlampbeads. All the modules can be used to lead out the module with the pin header, which is convenient for developers to develop and debug themselves; the integration of rich information, including AT instructions, SDK secondary development, support Bluetooth mesh networking, as well as Android / IOS APP control and WeChat Mini Program control, but also support Tmall genie voice direct connection control; multiple development boards interconnected, canbe used to Mesh networking debugging, 2.54 mm pin header lead out all GPIO/PWM/I2C/ADCinterfaces, free to match peripherals. UART interface support firmware burning, simple and fast! At the same time pin SWS pin with Telink official burning tools can also achieve firmware burning. 

Features:

• Module: TB-03F-Kit (TB-03F module development board)
• Two options for firmware: Ali Tmall genie version; common AT version
• BLE5.0,support Mesh
• Interface Type: Standard micro USB + 2.54mm spacing pin header
• PWM/I2C/GPIO/ADC interface
• With R/G/B colorful lights and cold and warm lamp beads
• With reset and user-defined button
• Support Tmall Genie Voice Direct Control
• Support Android/ IOS APP control and WeChat Mini Program control

Specifications:

• Model: TB-03F-KIT Development Board
• Package: DIP-30 (2.54 mm spacing pin header)
• Dimension: 24.0*16.0*3.0(±0.2)MM
• Wireless Standard: Bluetooth 5.0,support Mesh
• Frequency Range: 2400 ~ 2483.5MHz
• Transmit Power: Maximum 10dBm
• Receiving Sensitivity: Minimum 93 dBm±2
• Interface: PWM/I2C/GPIO/ADC
• Operating Temperature: -20°C ~ 70°C
• Storage Temperature: -40°C ~ 125°C,<90%RH
• Power Supply Range: Micro USB supply voltage 4.75V ~ 5.25V, recommend 5.0V
• Power Consumption: Deep sleep mode: 0.4uA (only module); Standby mode: 2.51mA (only module); Full-load mode (TX: 10dBm), 20.54mA (only module); Development Board PCB:4mA